The Modular Vacuum Press MVP24 series 1 is a modular line that can operate in line with a Roll to Roll system conveyor.
It is designed and built to eliminate trapped air bubbles from the surfaces and provide perfect encapsulation of the traces and a flatness surface of a printed circuit board, Flex PCB, Rigid-Flex PCB, HDI PCB, IC substrate, and Semiconductors.
The machine can be selected to process single or double side; in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder-mask, dielectric film, copper foil for SBU technology and many other film layup applications.
The Flat Press module ensures a good flatness surface and adhesion.
A combination of heat, vacuum, pressure, and flatness processes are utilized in the lamination cycle.
The machine has a data management system to control and record the process parameters using the latest technology of software & hardware.
