Vacuum Press Laminator RTR MVP24

The Modular Vacuum Press MVP24 series 1 is a modular line that can operate in line with a Roll to Roll system conveyor.
It is designed and built to eliminate trapped air bubbles from the surfaces and provide perfect encapsulation of the traces and a flatness surface of a printed circuit board, Flex PCB, Rigid-Flex PCB, HDI PCB, IC substrate, and Semiconductors.
The machine can be selected to process single or double side; in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder-mask, dielectric film, copper foil for SBU technology and many other film layup applications.
The Flat Press module ensures a good flatness surface and adhesion.
A combination of heat, vacuum, pressure, and flatness processes are utilized in the lamination cycle.
The machine has a data management system to control and record the process parameters using the latest technology of software & hardware.

Vacuum Press Laminator

Advantages

  • Stainless steel construction suitable for clean room operation
  • Dynamic and static slap down pressure
  • State-of-the-art vacuum technology
  • Standalone box for vacuum pump and oil press pump
  • Vacuum heating plates controlled by double zone for fine temperature accuracy
  • Flat Press heating plates with multiple thermocouples for fine temperature accuracy
  • Flat Press plates pressure adjustable by ramp
  • Cleaning modules with extractable adhesive rolls (option)
  • Comfortable access to the working modules for cleaning or maintenance operations
  • Flat Press with cooling system (option)
  • Refrigerator plate for exit panels (option)
  • HEPA filters available for both modules (option)

 

Additional information

Application

PCB, Semiconductors