Vacuum Laminator RTR MVC24 Series 2

The Vacuum Laminator MVC24 Series 1 is a modular machine that can be operated in inline or stand alone operation. It has designed and built to eliminate encapsulation of air from the surfaces and perfect encapsulation of the traces of a printed circuit board, IC substrate, Semiconductors, solar cells.

The machine can be selected to process single or double side; in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film soldermask, ConforMASK dielectric film, copper foil for SBU technology, coverlayer and many other film layup applications. The machine ensures a perfect adhesion of the film and eliminate air bubbles. Combination of heat, vacuum and high lamination pressure are utilised in the lamination cycle.

The machine has data management system to control and record the process parameters via an latest technology of software & hardware.


  • Suitable for flex, innerlayer and rigid substrates, thickness range from 0,05÷3,2 mm (0.002 core÷0.13 in)
  • High lamination pressure adjustable from ATM to 6 kg/cm² (ATM to 85.3 PSI)
  • Dynamic and Static slap down cycles available for better quality lamination
  • State-of-the-art vacuum technology
  • Oil or Dry pump available
  • Vacuum heating plate controlled by double zone for better temperature uniformity
  • OMRON PLC and operator interface in local language
  • Automatic upper plate unlocking & opening by servo motor cylinder
  • Over 100 recipes can be managed
  • Statistic Process Control as option (SPC)
  • Easy data system proprietary software provided
  • Modular design for easier line upgrading

Release: Rev.00 EN17


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