High-Yield Vacuum Laminator for large formats
Engineered for high-volume, high-precision production environments, the Vacuum Applicator VA 7336-HP3 is the ultimate stand-alone solution designed to achieve complete void elimination and flawless, total trace encapsulation.
Specifically developed to serve top-tier sectors—including PCB, IC Substrates, Semiconductors, and Wafer Cells—the VA 7336-HP3 powers simultaneous double-sided lamination with outstanding quality. It delivers extraordinary conformation around ultra-fine patterns using dry film photoresist, dry film solder mask, ConforMASK, dielectric films, and advanced cover layers.
Why the VA 7336-HP3 Stands Out
100% Bubble-Free Results: Synergistic integration of uniform heat, high vacuum, and intense pressure guarantees perfect film-to-substrate adhesion with zero trapped air.
Industry 4.0 Smart Supervision: Seamlessly integrates with an optional data management software suite to monitor, control, and trace all process parameters in real time. Pre-set for barcode reader operation.
Streamlined Automation: Features an intuitive 10″ color touchscreen display and motor-driven upper plate movement for fast, reliable, and effortless cycle management.
