Vacuum Lamination Excellence
Engineered to exceed the highest industry standards, the rew realeased Vacuum Applicator VA 7324-HP7 is the ultimate stand-alone solution designed to deliver flawless, bubble-free lamination and complete, perfect encapsulation of fine traces.
Tailored for cutting-edge industries—including PCB, IC Substrates, Semiconductors, and Wafer Cells—the VA 7324-HP7 enables simultaneous double-sided application. It delivers superior lamination quality and conformation to even the most complex fine patterns using dry film photoresist, dry film solder mask, ConforMASK, dielectric films, and cover layers.
Why Choose the VA 7324-HP7?
Flawless Adhesion & Zero Air Bubbles: The synergistic combination of uniform heat, high vacuum, and intense lamination pressure eliminates micro-voids for an impeccable finish every time.
Smart Control & Industry 4.0 Ready: Seamlessly integrates with advanced data management systems to monitor and supervise all process parameters in real-time via dedicated software, pre-set for barcode reader integration.
Premium Engineering: Top-tier performance built into a robust, elegant structure that embodies authentic Italian industrial design and expertise.
