The Vacuum Applicator 7224-HP7 is a standalone machine, designed and built to ensure complete elimination of air from the surfaces of a printed circuit board, as well as perfect encapsulation of the traces. The machine has been developed for simultaneous application on both sides of the PCBs (flexible and rigid) in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film soldermask or ConforMASK, dielectric film, copper foil for SBU technology and coverlayer application. The machine ensures a perfect adhesion of the products and that there are no air bubbles.
The Vacuum Applicator 7224-HP7 employs heat, vacuum and high lamination pressure. The machine is provided with a data management system to supervise and control the process
parameters via an appropriate software.