The Automatic Vacuum Lamination Press Line (AVPL Line) is an in-line modular system which includes the Pre-Tack Laminator, the Modular Vacuum Chamber MVC 30, the Flat Press FP30 with PET RTR Carrier System Conveyor.
It is designed to ensure a perfect adhesion of the material and eliminate trapped air bubbles from the surfaces providing perfect encapsulation of the traces and a surface flatness of a printed circuit boards, Flex PCB, Rigid-Flex PCB, HDI PCB, IC substrate, Semiconductors.
The machine can be selected to process single or double-side in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder-mask, dielectric film, copper foil for SBU technology and many other film layup applications.
The Flat Press module ensures a good surface flatness and adhesion.
A Combination of heat, vacuum, pressure and flatness processes are utilized in the lamination cycle.
The machine is equiped with a data management system to control and record the process parameters using the latest software & hardware technology.
