Automatic Vacuum Lamination Press Line AVPL 30

The Automatic Vacuum Lamination Press Line (AVPL Line) is an in-line modular system which includes the Pre-Tack Laminator, the Modular Vacuum Chamber MVC 30, the Flat Press FP30 with PET RTR Carrier System Conveyor.
It is designed to ensure a perfect adhesion of the material and eliminate trapped air bubbles from the surfaces providing perfect encapsulation of the traces and a surface flatness of a printed circuit boards, Flex PCB, Rigid-Flex PCB, HDI PCB, IC substrate, Semiconductors.
The machine can be selected to process single or double-side in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder-mask, dielectric film, copper foil for SBU technology and many other film layup applications.
The Flat Press module ensures a good surface flatness and adhesion.
A Combination of heat, vacuum, pressure and flatness processes are utilized in the lamination cycle.
The machine is equiped with a data management system to control and record the process parameters using the latest software & hardware technology.

Automatic Vacuum Lamination Press Line AVPL 30

Advantages

  • Stainless steel construction-suitable for clean room operation
  • Dynamic and static slap down pressure
  • Ramp pressure lamination (patent pending)
  • State-of-the-art vacuum technology
  • Standalone box for vacuum pump and oil press pump
  • Vacuum heating plates controlled by double zone for fine temperature accuracy
  • Flat Press heating plates with multiple thermocouples for better temperature accuracy
  • Flat Press plates pressure adjustable by ramp
  • Cleaning modules with extractable adhesive rolls (option)
  • Comfortable access to the working modules for cleaning or maintenance operations
  • Flat Press with cooling system
  • Cooling system device for exit panels
  • ESD compliance
  • HEPA filters available for both modules (option)

Additional information

Application

PCB, Semiconductors