The Automatic Vacuum Lamination Press Line (AVPL Line) is an in-line modular system which includes the Pre-Tack Laminator, the Modular Vacuum Chamber MVC 24, the Flat Press FP24 with PET RTR Carrier System Conveyor.
It is designed to ensures a perfect adhesion of the material and eliminate trapped air bubbles from the surfaces and providing perfect encapsulation of the traces and a flatness surface of a printed circuit board, Flex PCB, Rigid-Flex PCB, HDI PCB, IC substrate, Semiconductors.
The machine can be selected to process single or double side; in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder-mask, dielectric film, copper foil for SBU technology and many other film layup applications.
The Flat Press module ensures a good flatness surface and adhesion.
Combination of heat, vacuum, pressure and flatness processes are utilized in the lamination cycle.
The machine has data management system to control and record the process parameters using the latest technology of software & hardware.