Automatic Vacuum Lamination Line

The vacuum lamination process ensures a complete elimination of air from the surfaces of a printed circuit board, as well as perfect encapsulation of the traces.

The machine has been developed for simultaneous application on both sides of the PCBs (flexible and rigid) in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film soldermask and ConforMASK dielectric film, copper foil for SBU technology and coverlayer application.

The machine ensures a perfect adhesion of the dry film and that there are no air bubbles.

The unit employs heat, vacuum and high pressure lamination and  is suitable for in-line or stand-alone mode operation.

The machine is provided with a data management system to supervise and control the process parameters via an appropriate software.

Advantages

  • Suitable for innerlayer or rigid panels-thickness range from 0,1 ÷ 3,2 mm.
  • Clamps system on the exit conveyor for panel extraction.
  • High lamination pressure adjustable up to 7Kg.
  • Dynamic and static slap down cycles for better quality laminination.
  • State-of-the-art vacuum technology
  • Max. lamination temperature 180°C (356°F) – platen controlled by double zone for better temperature uniformity
  • Completely controlled by OMRON PLC-operator interface in local language.
  • Output panel temperature detection (only with silicone conveyor).
  • The system can be either equipped with Silicone rubber conveyor or Upper/Lower RTR PET carrier system.
  • Upper plate opening by servo motor cylinder.
  • Over 100 recipes can be managed.
  • Equipped with brushless servo-motor
  • Statistic Process Control (SPC) – Easy data system proprietary software provided *

* Local and remote supervision, management and monitoring data by PC, auto–tuning for panel exit temperature, management of maintenance operations; automatic set-up of working parameters.

Video

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Additional information

Application

PCB, Semiconductors

Automatic Vacuum Lamination Line

真空层压工艺确保完全消除印刷电路板表面的空气,以及完美的迹线封装。
该机器已经开发用于在电路板的两面同时应用(软性和硬性),以实现高层压质量和精细图案的良好构造,为干膜,干膜焊接掩膜和ConforMASK介电膜,用于SBU技术的铜箔 和覆盖膜应用程序。
该机器确保干膜的完美附着,并且没有气泡。 该装置采用加热,真空和高压层压而成
适用于在线或独立模式操作。
该机器配有数据管理系统,通过适当的软件监督和控制过程参数

好处

  • 适用于内层或硬性板 – 厚度范围为0.1到6 mm(0.004芯到0.236 in.)。
  • 可以使用1或2个面板/循环运行
  • 高层压压力可调 – 从大气压到6 kg / cm2(大气压到85.3 PSI)
  • 动态和静态拍打循环
  • 最先进的真空技术
  • 最大层压温度180°C(356°F) – 单独控制压板温度
  • 完全由OMRON PLC操作员界面以本地语言控制
  • 输出面板温度检测
  • 系统可配备硅橡胶输送机或上/下卷对卷PET传送膜系统
  • 上台面通过伺服电机缸开口
  • 出口输送机上的夹具系统,用于面板提取
  • 可以管理超过100个配方
  • 配备无刷伺服电机
  • 统计过程控制(SPC) – 提供简单的数据系统专有软件*

* 通过PC进行本地和远程监控,管理和监控数据,自动调整面板出口温度,维护操作管理;自动设置工作参数。

Release: Rev.01 EN17

Video


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Application