Automatic Lamination Technology under brand name Dynachem are pleased to announce that ELTOS S.p.A Italy (http://www.eltos.com) has installed state of the art Dry Film Lamination Line for Inner layers.

We are extremely proud that one of the most important Italian manufacturer of high technology printed circuit boards have renewed their trust in Dynachem by purchasing the Cut Sheet Laminator series 5200.

SmartLam 5200 has the flexibility to manage either panel types down to 1mil core (rigid and flex), using Dynachem unique clamping Thin Layer support and  the automatic dry film tension device, and up to 12.7mm thickness without any special adjustment. Machine can be equipped also with its own Wet Module when higher dry film adhesion is required. In addition the new HMI software meets the industry 4.0 requirement (data log for every production batch and different users levels are available) and it can support also the SECS/GEM protocol when requested.

Automatic Lamination Technologies under brand name Dynachem are pleased to announce that Cistelaier S.p.A. company belonging to FinMasi Group PCB Division Italy (http://www.cistelaier.it) has installed state of the art Dry Film Lamination Line for Inner layers.

We are extremely proud that one of the most important Italian manufacturers prototypes, small, medium and large series of a very wide range of printed circuit boards (up to 40 layers): double-sided, multilayer, rigid-flex, HDI (multilayer as well as flex-rigid) PCBs has renewed their trust in Dynachem by purchasing the Cut Sheet Laminator series 5200.

SmartLam 5200 has the flexibility to manage either panel types down to 1mil core (rigid and flex), using Dynachem unique clamping Thin Layer support and  the automatic dry film tension device, and up to 12.7mm thickness without any special adjustment. Machine can be equipped also with its own Wet Module when higher dry film adhesion is required. In addition the new HMI software meets the industry 4.0 requirement (data log for every production batch and different users levels are available) and it can support also the SECS/GEM protocol when requested.

Dynachem ALT announces the recent acquisition of the www.dynachem.org domain.

Dynachem.org is a historical domain for the “Dynachem” brand and for this, we would say thank you to Dan Feinberg, who has kept that alive for more than 10 years and has kindly granted that free of charge.

Dan Feinberg was a formally president of Morton Electronic Materials (Dynachem) and Group V.P. of Morton International.

Member of IPC for almost 50 years and member of IPC Hall of Fame

Mr. Feinberg and his associates specialize in management consulting, technology transfer, and new product market entry, including distribution introductions, merger and acquisition due diligence, market information and market research, expert witness assistance and seminars regarding all aspects of printed circuits, and electronic assembly manufacturing and marketing.

Website: http://www.feinline.com

Automatic Lamination Technologies announces the recent acquisition of J-MEC in Arcisate Italy, mechanical shop & new solutions as a new subsidiary into the Brand Dynachem group of companies, we believe that their expertise in mechanical shop solutions will greatly contribute toward expanding our product offerings and improving the developing of new projects as well.

As part of A.L.Tech group continuing expansion, the new acquisition of J-MEC will improve our business growth to our existing customers.

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GS invests in new lamination line technology

Automatic Lamination Technologies (ALT) under brand name Dynachem are pleased to announce that GS (Switzerland) advance substrate manufacturer has purchased and installed Dynachem latest developed Automatic Vacuum Press Lamination line AVPL Series 2 system.

AVLP S2 is the new generation modular machine that provides customer an option to extend the system from single Vacuum stage to dual Flat Press stage lamination.

ALT – Dynachem is extremely pleased to have been selected by GS. We believe that our Dual Vacuum Press stages lamination can satisfy the high technology required in the current electronic industry, especially in the demanding substrate-manufacturing sector.

This latest AVLP line has the flexibility to manage either hot roll dry film lamination with substrate types down to 1mil core, vacuum dry film / solder mask lamination with R/Flex panel, complete coverlay lamination and curing, and vacuum & press ABF lamination for sequential build up technology.

In addition the new HMI software meets the industry 4.0 requirement (data log for every production batch are available) and it can support the SECS/GEM protocol mostly used in the semiconductors industry.

Please feel free contact us, see for yourself, and try out samples in demonstration facility.

For more information follow the link below:

For more info click here.