Module Vacuum Press MVP-24 S2

The Modular Vacuum Press MVP24 Series 2 is a modular line that can operated in line with a Roll to Roll system conveyor. It is designed and built to eliminate trapped air bubbles from the surfaces and providing perfect encapsulation of the traces and a flatness surface of a printed circuit board, Flex PCB, Rigid-Flex PCB, HDI PCB, IC substrate, Semiconductors.

The machine can be selected to process single or double side; in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film solder-mask, dielectric film, copper foil for SBU technology and many other film layup applications.

The Flat Press module ensures a good flatness surface and adhesion. Combination of heat, vacuum, pressure and flatness processes are utilized in the lamination cycle.

The machine has data management system to control and record the process parameters using the latest technology of software & hardware.

Advantages

  • Suitable for flex, innerlayer and rigid substrates, thickness range from 0,05 – 3,2 mm (0.002 core – 0.13 in)
  • High lamination pressure adjustable from ATM to 6 kg/cm² (ATM to 85.3 PSI)
  • Dynamic and Static slap down cycles available for better quality lamination
  • State-of-the-art vacuum technology
  • Standalone box for Oil or Dry pump
  • Vacuum heating plate controlled by double zone for better temperature uniformity
  • OMRON PLC and operator interface in local language
  • Flat Press plates equipped with a cooling system for quick cooldown
  • Automatic upper plate unlocking & opening by servo motor cylinder
  • Over 100 recipes can be managed
  • Statistic Process Control as option (SPC) – Easy data system proprietary software provided
  • Modular design for easier line upgrading

Release: Rev.00 EN17